MECHANIC iT3 pro Intelligent Preheating Platform Motherboard Layered Chip BGA Stencil/Dot Matrix Repair For iPhone X-13 PRO MAX
Home » Tools » Tool Sets » MECHANIC iT3 pro Intelligent Preheating Platform Motherboard Layered Chip BGA Stencil/Dot Matrix Repair For iPhone X-13 PRO MAX
Price from: | 51.75 $ |
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Description:MECHANIC iT3 pro Intelligent Preheating Platform Motherboard Layered Chip BGA Stencil/Dot Matrix Repair For iPhone X-13 PRO MAXIntroducing the MECHANIC iT3 pro Intelligent Preheating Platform Motherboard Layered Chip BGA Stencil/Dot Matrix Repair, a cutting-edge solution for repairing iPhone X-13 PRO MAX devices. This intelligent preheating platform is specifically designed to provide efficient and precise repairs for intricate motherboard components. With its advanced features and versatility, it is the go-to tool for professional technicians looking to restore iPhones to their optimal functionality. The MECHANIC iT3 pro boasts a layered chip BGA stencil and dot matrix repair system, ensuring accurate and reliable repairs. This innovative technology allows for the precise placement of solder balls, enabling seamless connections between chips and the motherboard. With this platform, technicians can effortlessly repair various complex motherboard issues, including chip damage, faulty connections, and other common problems found in iPhone X-13 PRO MAX devices. Equipped with intelligent preheating capabilities, the MECHANIC iT3 pro ensures the even distribution of heat across the motherboard, preventing any potential damage during the repair process. The platform's intelligent temperature control system provides precise and consistent heating, allowing technicians to work with confidence. Additionally, its user-friendly interface and intuitive controls make it accessible to both seasoned professionals and beginners in the field of iPhone repairs. In conclusion, the MECHANIC iT3 pro Intelligent Preheating Platform Motherboard Layered Chip BGA Stencil/Dot Matrix Repair is a game-changer in the world of iPhone repairs. Its advanced features, including the layered chip BGA stencil and |
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Created by: w-software.com | Dřevostavba svépomocí | Guitar Accesories | BMW F650 GS | LED bulbs
Digitální fotoaparát | Geolokace, IP location | Náramkové hodinky | LED žárovky | Minipočítače.cz | RC modely | Cheap Watch | Fotogalerie | Smartphone 1 | Burza domén | cooperate