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Amaoe BGA Reballing Stencil for Phone 14 Plus Pro Max A15 A16 Middle Layer CPU IC Chip Tin Planting Steel Net 0.12mm

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Enlarge Amaoe BGA Reballing Stencil for Phone 14 Plus Pro Max A15 A16 Middle Layer CPU IC Chip Tin Planting Steel Net 0.12mm
Amaoe BGA Reballing Stencil for Phone 14 Plus Pro Max A15 A16 Middle Layer CPU IC Chip Tin Planting Steel Net 0.12mm enlarge
Amaoe BGA Reballing Stencil for Phone 14 Plus Pro Max A15 A16 Middle Layer CPU IC Chip Tin Planting Steel Net 0.12mm enlarge
Amaoe BGA Reballing Stencil for Phone 14 Plus Pro Max A15 A16 Middle Layer CPU IC Chip Tin Planting Steel Net 0.12mm enlarge
Amaoe BGA Reballing Stencil for Phone 14 Plus Pro Max A15 A16 Middle Layer CPU IC Chip Tin Planting Steel Net 0.12mm enlarge
Price from: 55.50 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

Amaoe BGA Reballing Stencil for Phone 14 Plus Pro Max A15 A16 Middle Layer CPU IC Chip Tin Planting Steel Net 0.12mm
The Amaoe BGA Reballing Stencil is a must-have tool for professionals in the phone repair industry. Specifically designed for Phone 14 Plus Pro Max A15 A16 Middle Layer CPU IC Chip, this stencil allows for precise and efficient reballing of the chip's tin planting. With a thickness of 0.12mm, the steel net provides excellent durability and ensures long-lasting performance.

This reballing stencil is crafted with utmost precision, ensuring a perfect fit for the specified phone models. It enables technicians to effortlessly reball the middle layer CPU IC chip, which is crucial for proper functioning of the phone. The stencil's 0.12mm thickness ensures accurate and consistent tin planting, eliminating the risk of any damage to the chip.

Constructed from high-quality steel, this BGA reballing stencil is built to withstand repeated use without compromising its effectiveness. The steel net provides excellent heat resistance, ensuring that the stencil remains in optimal condition even during high-temperature reballing processes. Its durability and reliability make it a valuable addition to any professional phone repair toolkit.

Overall, the Amaoe BGA Reballing Stencil for Phone 14 Plus Pro Max A15 A16 Middle Layer CPU IC Chip Tin Planting Steel Net 0.12mm is a top-notch tool for phone repair professionals. Its precision, durability, and compatibility with specific phone models make it an essential component of any reballing process. Invest in this high-quality stencil to enhance your

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